NickelMaghrebV1, France, Analysis, bibRecord, 000205

Palladium (+2) reduction : A key step for the electroless Ni metallization of insulating substrates by a tin-free process

Identifieur interne : 000205 ( France/Analysis ); précédent : 000204; suivant : 000206

Palladium (+2) reduction : A key step for the electroless Ni metallization of insulating substrates by a tin-free process

Auteurs : M. Charbonnier [France] ; M. Romand [France] ; Y. Goepfert [France] ; D. Leonard [France] ; F. Bessueille [France] ; M. Bouadi [Algérie]

Source :

Thin solid films [ 0040-6090 ] ; 2006.

RBID : Pascal:07-0287541

Descripteurs français

Pascal (Inist)
- Métallisation, Etain, Catalyseur, Liaison covalente, Couche mince, Effet contrainte, Adhérence, Tribologie, Propriété mécanique, Interface, Catalyse, Dépôt plasma, Spectre photoélectron RX, Palladium, Nickel, Titane nitrure, Phosphore, Pd, TiN, Ni, 6860B, 8265, 8115J, 5277D.
Wicri :
- topic : Nickel, Phosphore.

English descriptors

KwdEn :
- Adhesion, Catalysis, Catalyst, Covalent bond, Interface, Mechanical properties, Metallizing, Nickel, Palladium, Phosphorus, Plasma deposition, Stress effects, Thin film, Tin, Titanium nitride, Tribology, X-ray photoelectron spectra.

Abstract

The tin-free electroless metallization process developed in our laboratory consists in attaching the Pd(+2)-based catalyst on surfaces which were previously grafted with nitrogen-bearing groups. The so-functionalized surfaces lead to the formation of true covalent bonds between palladium and nitrogen-based species. In this work, the different steps of the process are studied, namely: (i) the grafting of nitrogen-bearing groups on an insulating surface by various processes already used in our laboratory, (ii) the seeding of the surface with Pd(+2) species, (iii) the reduction of Pd(+2) to Pd(0) by different routes (this step is needed due to the use of industrial plating baths which contain strong stabilizers that prevent or delay plating), (iv) the Ni metallization using low- and high-phosphorus plating baths. Phosphorus which originates from the plating bath reducer is partly incorporated in the Ni films and creates some stresses. Adhesion of the resulting films is evaluated by the Scotch® tape test. The main parameters responsible for adhesion and governing the characteristics of the Ni film/substrate interface are: the nature of the substrate, the Pd(+2) reduction route and the phosphorus content of the Ni plating bath. All these parameters influence the amount of stresses generated both at the metal/substrate interface and within the film.

Affiliations:

Links toward previous steps (curation, corpus...)

to stream PascalFrancis, to step Corpus: 000251
to stream PascalFrancis, to step Curation: 000190
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to stream Main, to step Exploration: 000711
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Pascal:07-0287541

Le document en format XML

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<term>Catalysis</term>
<term>Catalyst</term>
<term>Covalent bond</term>
<term>Interface</term>
<term>Mechanical properties</term>
<term>Metallizing</term>
<term>Nickel</term>
<term>Palladium</term>
<term>Phosphorus</term>
<term>Plasma deposition</term>
<term>Stress effects</term>
<term>Thin film</term>
<term>Tin</term>
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<keywords scheme="Pascal" xml:lang="fr"><term>Métallisation</term>
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<term>Catalyseur</term>
<term>Liaison covalente</term>
<term>Couche mince</term>
<term>Effet contrainte</term>
<term>Adhérence</term>
<term>Tribologie</term>
<term>Propriété mécanique</term>
<term>Interface</term>
<term>Catalyse</term>
<term>Dépôt plasma</term>
<term>Spectre photoélectron RX</term>
<term>Palladium</term>
<term>Nickel</term>
<term>Titane nitrure</term>
<term>Phosphore</term>
<term>Pd</term>
<term>TiN</term>
<term>Ni</term>
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<term>8265</term>
<term>8115J</term>
<term>5277D</term>
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<front><div type="abstract" xml:lang="en">The tin-free electroless metallization process developed in our laboratory consists in attaching the Pd(+2)-based catalyst on surfaces which were previously grafted with nitrogen-bearing groups. The so-functionalized surfaces lead to the formation of true covalent bonds between palladium and nitrogen-based species. In this work, the different steps of the process are studied, namely: (i) the grafting of nitrogen-bearing groups on an insulating surface by various processes already used in our laboratory, (ii) the seeding of the surface with Pd(+2) species, (iii) the reduction of Pd(+2) to Pd(0) by different routes (this step is needed due to the use of industrial plating baths which contain strong stabilizers that prevent or delay plating), (iv) the Ni metallization using low- and high-phosphorus plating baths. Phosphorus which originates from the plating bath reducer is partly incorporated in the Ni films and creates some stresses. Adhesion of the resulting films is evaluated by the Scotch® tape test. The main parameters responsible for adhesion and governing the characteristics of the Ni film/substrate interface are: the nature of the substrate, the Pd(+2) reduction route and the phosphorus content of the Ni plating bath. All these parameters influence the amount of stresses generated both at the metal/substrate interface and within the film.</div>
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Palladium (+2) reduction : A key step for the electroless Ni metallization of insulating substrates by a tin-free process

Palladium (+2) reduction : A key step for the electroless Ni metallization of insulating substrates by a tin-free process

Source :

Descripteurs français

English descriptors

Abstract

Links toward previous steps (curation, corpus...)

Links to Exploration step

Le document en format XML

Pour manipuler ce document sous Unix (Dilib)

Pour mettre un lien sur cette page dans le réseau Wicri